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锡基

网络tin based; Sn-based; Sn-Co

锡基

锡基

tin based

锡基轴承合金,tin-base... ... ) stannum based axletree alloy 锡基轴承合金 ) tin based 锡基 ) tin based alloy 锡基合金 ...

Sn-based

在本论文中，我们展示了采用了锡基(Sn-based)金属焊球(solderball)用於制备金属基板之技术。透过对镍金属网格的对准，锡基 …

Sn-Co

...种产品中的铬有了严格的限制.因此,开展用三价铬或者锡基(Sn-Co)、镍基(Ni-W)合金等代替六价铬的电镀工艺成为国内外工业 …

1

Magic in Siquijor consists mainly of traditional beliefs that have existed in the Philippines for centuries .

锡基霍尔的巫术多半植根于在菲律宾存在了好几个世纪的传统观念。

2

Studies of tin based anode materials for lithium ion secondary battery have been reviewed .

综述了锂离子蓄电池锡基负极材料的研究。

3

Pewter : Tin-based alloy used to make domestic utensils .

白镴：锡基合金，用来制作家庭器皿。

4

sorcery , both for good and evil , is a fact of life in the island province of Siquijor.

无论正邪，巫术是锡基霍尔岛（省）不可改变的事实。

6

With lead -free trend in electronic package , it is necessary to choose lead -free tin-base electrodeposits for electronics industry.

随着电子封装无铅化的趋势，选择无铅锡基镀层已成为必然。

7

METALLURGY. CHEMICAL ANALYSIS. TIN AND LEAD ANTIFRICTION ALLOYS.

锡基和铅基的抗摩擦合金的化学分析

8

The President of Finland J. K. Paasikivi declared the Games open.

芬兰总统 J.K 。帕锡基维宣布奥运会开幕。

9

10

A tin-based plating film with suppressed whisker growth is provided .

本发明提供一种晶须生长得到抑制的锡 -基镀膜。

11

Three elements in the reference materials of Sn -alloy were analyzed by ED-XRF.

本文提出 X 荧光能谱法测定锡基合金中三个元素含量的方法。

12

In addition , it's difficult to form the repair layer in aqueous medium as such as the materials is kaiserzinn.

另外，修复层在水溶液以及摩擦材料为锡基合金时难以形成。

13

Synthesis and study of highly dispersed tin and tin -cobalt alloy composite anode materials for Li-ion batteries

锂离子蓄电池锡基复合负极材料的研究

15

High Solderability Tin alloy Electroplating Technology for Aluminum and Its Alloy

铝及铝合金电镀高可焊性锡基合金工艺

17

Preparation of tin-based oxides thin films and its'electrochemical properties

锡基氧化物薄膜的制备与电化学性能

19

20

Study of wettability of rapidly solidified tin-based solders

快凝锡基软钎料的浸润性研究

21

Preparation and Electrochemical Properties of Tin-based Composite Oxide by High-energy Ball -milling Method

锡基复合氧化物的高能球磨法制备及其电化学性能

22

23

Development on Microelectronic Interconnection Tin -Based Lead-Free Solder Alloy

微电子互连锡基无铅焊料的发展

24

Method for chemical analysis of tin-base bearing alloy - Part 15: Thiourea photometric method for the determination of bismuth content

锡基轴承合金化学分析方法。第15 部分：硫脲光度法测定铋量

25

Method for chemical analysis of tin-base bearing alloy - Part 2: Potassium bromate method for the determination of antimony content

锡基轴承合金化学分析方法。第2 部分：溴酸钾滴定方法测定锑量

27

Method for chemical analysis of tin-base bearing alloy - Part 4: Electrolytic process for the determination of copper content

锡基轴承合金化学分析方法。第 4 部分：电解法测定铜量

28

Synthesis and Structural Characterization of 3 -Trichlorostannylpropionates and Their Complexes

3 -三氯锡基丙酸酯及其配合物的合成与结构表征

29

Study on electrochemical properties of tin-based composite electrode

锡基复合电极的电化学性能研究

30

Determination of Stibium in Tin Solder by Flame Atomic Absorption Spectrometry

火焰原子吸收光谱法测定锡基焊料中锑

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