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划片

na.【电】scribing
网络Dicing; Saw; scribe

划片

英-汉网络释义

划片

scribing

半导体词典（3）_翻译家(Fanyijia.com) ... • SCRAP -- 废弃 • Scribing -- 划片 • Scribe Line or Saw Lane -- 划片线或锯线 ...

Dicing

划片（dicing）是集成电路加工中后道工序的关键的一个步骤，切割质量的好坏直接影响芯片（chip）的封装测试，划片刀是芯 …

Saw

敦南科技(无锡)有限公司-首页 ... Probe( 针测） Saw( 划片） Coating( 涂胶） ...

scribe

最终，象切割玻璃那样，用碳化钨刀片对硅晶片进行划片（scribe），把每个晶片分割成几千个集成电路芯片，每个芯片的面积 …

Dicing Saw

低 k 材料的引入给半导体封装中的划片（Dicing Saw）和焊线(Wire Bonding)工艺带来了挑战[6]。 4 在划片工艺中金属层与 IL…

die saw

划片(die saw):采用划片刀片将晶圆(wafer)划切成管芯(die)的操作过程.龙山野人回答采纳率:23.7% 2009-06-05 19:28 您已经评 …

Wafer Saw

封装专业术语集锦.pdf - 豆丁网 ... 划片 Sawing 1 划片 Wafer saw 2 (铁环) 4 5 清洗机 Wafer cleaner 6 ...

Die Sawing

2. 划片（die sawing），用高速旋转的金刚石刀片在切割道上来回移动，将die分离。现在激光切割正逐渐普及，对薄的wafer激 …

例句：

Upon the installation of a multi beam laser dicing system , the obviously advantages of using such a laser dicing process become evident .

基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。

The design of mechanical system of sand-wheel slice cutting machine, under the direction of precision theory, is introduced in this thesis.

本文介绍了在精度理论指导下进行的砂轮划片机机械系统的设计。

The characteristic of RF CO2 laser and its ceramic substrate scribing are presented .

介绍了 RFCO2 激光器及其陶瓷基板划片的特点；

The mechanism of scribing ceramic substrate by using RF CO2 laser is analyzed . The design of the scribing system is presented .

分析了 RFCO2 激光陶瓷基板划片的机理，给出了整机总体设计方案。

The application of a servo system in the ZSH5 dicing saw was introduced .

介绍了伺服系统在砂轮划片机中的应用情况。

after anneal , scribing and packaging .

高温退火后，划片、封装。

general specification for automatic wheel scribing machine

自动砂轮划片机通用技术条件

The Analysis of Design Principles for the Dicing Saw's Vision Recognition System

划片机视觉识别系统设计原理分析

Thoughts of Extending City Tax Management Dividing into Zones

对推广城市税收划片管理的思考

The Mathematic Model Analysis On Dicing Saw's Blade Dressing

砂轮划片机刃具修整数学模型分析

This paper establish mathematic model according to Dicing Saw's cutting principle ;

从划片机的划切机理出发建立数学模型；

Development of Wafer Incision Machine for IC Encapsulation

IC 封装设备划片机的研制

Study on Air Spindle's Thermal Characteristic in the Dicing Saw

划片机气静压电主轴热态特性研究

Study on Air Spindle's Cooling and Thermal Transfer in the Dicing saw

划片机气静压电主轴的冷却与热传递研究

The Application of Linear Motor in Dicing Machine

直线电机在划片机中的应用

A Research on Dicing Technology of Wheel Wafer Dicer

砂轮划片机划切技术的研究

Study on Key Technologies of Full Auto Dicing Saw

全自动划片机的关键技术研究

How to Use Recognition and Matching Technique in Full Automatic Dicing Saw

全自动划片机自动识别对准技术的研究

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