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铜箔

na.clutch gold; copper foil
网络CCL; Cu foil; RCC

铜箔

英-汉网络释义

铜箔

copper foil

电子变压器_百度百科 ... 磁芯( Ferrite Core,SI-Steel Lamination) 铜箔( Copper Foil) 绝缘胶带( Tape) ...

CCL

...的胶( Ep o x y ) 当接著剂，将基材与铜箔( CCL ) 做紧密的黏合，而后利用酸或硷等光学及化学药剂蚀刻铜箔，形成所需要 …

Cu foil

41 覆铜板结构图：它由铜箔(Cu foil)、面料(Face)、芯料(Core) 三部分构成（结构如下），经过高温热压固化成型。 1 2 3 4 5 …

clutch gold

gold的翻译中文意思-在线英汉词典 ... cat gold 金色云母 clutch gold 铜箔, 铜锌合金箔 coarse gold 粗粒金 ...

RCC

敷树脂铜箔（RCC）、激光钻孔、蚀刻线路、制作CBUM板。4、日本、TOSHIBA公司采用B2IT加工技术，应用铜箔表面印导 …

foil copper

金属材料工程专业英语 - 豆丁网 ... foil 箔、薄金属片 foil copper 铜箔 foil mill 箔材轧机 ...

ED Foil

35、Matte Side 毛面在电路板工业中系指电镀铜箔(ED Foil) 之粗糙面。是在硫酸铜镀液中以高电流密度(1000 ASF 以上)及阴阳 …

FCCL

...屏用硬化膜，太阳能面板封装材料，锂电池正负极，柔性铜箔(FCCL)，隔热膜和各类高性能电子胶带上。

例句：

Take brass grid and copper foil as current collectors of the electrode, the charge-discharge performances were better than other materials .

通过比较发现，扎孔的铜箔作为集流体材料，性能与铜箔相差无几。

a circuit formed by two faces of copper foils of the ceramic substrate are interconnected and guided through a sintered via hole .

陶瓷基板两面铜箔构成的线路通过烧结而成的过孔进行互联导通。

The relationship of the welding seam microstructure of the drum cathode and the light region forming on the copper foil surface was studied .

研究了阴极辊焊缝处组织与电解铜箔表面上形成的光亮带之间的关系。

In this thesis , PCB is considered as a multi- lamina material which consists of copper lamina and strengthened resin with glass fiber.

本论文中，考虑 PCB 板是复合材料的组成包括铜箔与玻璃纤维强化树脂。

Deburring As drill removes copper a small copper ridge forms around the hole edge .

去毛刺 -钻孔后会在铜箔和孔壁上产生粗糙边。

adoption of the copper foil thickness : copper foil thickness on the circuit conductor density has a significant impact.

拔取的铜箔厚度：铜箔的厚度不不对电路图形的导线密度有着次给感化。

Refined copper foil , not backed, in thickness less than 0 . 07 mm, whether or not coated with resin.

精炼铜箔，未衬，其厚度在 0.07 公厘以下者，不论是否有树脂涂布。

The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper .

介绍了覆铜箔板纸的用途，覆铜箔板的制造过程和应用。

It includes non- magnetizer basis material covered by copper film, winding covered by copper film and non-magnetizer material{##**$$}{##**$$} board .

它包括覆铜箔板非导磁基材、覆铜箔线圈和非导磁材料板。

Then, the thickness of copper foil and strand diameter of Litz wire is discussed to obtain the minimum winding losses .

最后针对最小线损下，探讨铜箔厚度及多股绞线直径之最佳设计尺寸。

By using commercial copper foil and gold gluing oil, the sample of copper gilding was prepared with traditional gilding techniques .

用市售铜箔和金胶，采用传统贴金工艺制备贴铜样品。

This article mainly tell the process of electrolysis copper foil surface treatment and changes in Electro-plate layer crystalline forms .

本文阐述电解铜箔表面处理工艺过程与镀层结晶形态的变化。

EMI electromagnetic shielding materials supply , electrical tape , copper foil, aluminum foil tape, theUnited Statesprofile belt.

供应 EMI 电磁屏蔽材料，导电胶带，铜箔、铝箔胶带，美纹胶带。

The invention discloses metal-based composite medium foil plate to cover cupper.

本发明公开了一种金属基复合介质覆铜箔板。

A copper foil solution is used to bond the glass pieces together , and then the pieces are soldered together firmly .

铜箔解决方案可使玻璃碎片结合在一起，然后一起焊接牢固。

Measuring contact resistance betweenMWCNT film and copper foil substrates.

测量铜箔与碳纳米管膜的接触电阻。

The results show that the broken type is brittle rupture, there are slip bands, and the caused reason is the expanding of graphite .

结果发现因为石墨膨胀造成铜箔拉裂的为脆性断裂。且有滑移带。

This company produces copper foil, aluminous foil, gold foil, and silver foil .

本公司专业生产铜箔、铝箔、金箔和银箔。

when the lithium ion battery pole roll adopts a negative pole roll , the metallic foil adopts a copper foil .

当锂离子电池极卷为负极极卷时，所述金属箔为铜箔。

Copper clad laminate , polyimide backed , of a thickness not exceeding 0 . 07 mm .

铜箔基板，以聚醯亚氨为衬，其厚度在 0.07 公厘及以下者。

Copper clad laminate , other backed , of a thickness not exceeding 0 . 07 mm.

铜箔基板，其它衬者，其厚度在 0.07 公厘及以下者。

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